Molded chip fabrication method and apparatus

摘要

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

主权项

1. A method for fabricating a solid state light emitter, comprising:
bonding at least one light emitting diode (LED) chip to a temporary bonding media, said at least one LED chip comprising first and second contacts on at least one surface; applying a coating to the at least one LED chip on the bonding media such that at least a portion of a surface of said contacts is not covered by said coating material; and removing the at least one LED chip with said coating from the bonding media.