发明名称 |
Adhesive and method of encapsulating organic electronic device using the same |
摘要 |
An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. |
申请公布号 |
US9105648(B2) |
申请公布日期 |
2015.08.11 |
申请号 |
US201414289212 |
申请日期 |
2014.05.28 |
申请人 |
LG Chem, Ltd. |
发明人 |
Yoo Hyun Jee;Cho Yoon Gyung;Shim Jung Sup;Lee Suk Chin;Jeong Kwang Jin;Chang Suk Ky |
分类号 |
H01L29/08;H01L35/24;H01L51/00;H01L23/00;H01L51/52;H05B33/04;H01L51/56;C09J7/00;C09J7/02;H01L21/56;H01L23/28;H01L23/29;C08K3/22;C08K3/34;C08K3/36;C09J163/00;C08K3/16 |
主分类号 |
H01L29/08 |
代理机构 |
McKenna Long & Aldridge, LLP |
代理人 |
McKenna Long & Aldridge, LLP |
主权项 |
1. An adhesive for encapsulating an organic electronic device (OED), comprising:
a curable resin, and a moisture absorbent, wherein the adhesive comprises a first region coming in contact with the organic electronic device (OED); and a second region not coming in contact with the organic electronic device (OED), and wherein the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. |
地址 |
Seoul KR |