| 发明名称 | Ceramic electronic component with metal terminals | ||
| 摘要 | A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed. | ||
| 申请公布号 | US9105405(B2) | 申请公布日期 | 2015.08.11 |
| 申请号 | US201314024398 | 申请日期 | 2013.09.11 |
| 申请人 | TDK CORPORATION | 发明人 | Masuda Sunao;Kobayashi Katsumi;Komatsu Takashi;Yoshii Akitoshi;Hasebe Kazuyuki;Kusano Kayou;Ando Norihisa |
| 分类号 | H01G4/228;H01G2/06;H01G4/30;H01G4/232;H01G4/12 | 主分类号 | H01G4/228 |
| 代理机构 | Arent Fox LLP | 代理人 | Arent Fox LLP |
| 主权项 | 1. A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion, and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed. | ||
| 地址 | Tokyo JP | ||