Carrier tape for tab-package and manufacturing method thereof

摘要

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

主权项

1. A TAB tape, comprising:
a base film having a central area and edge areas at both directions of the central area; a wiring pattern formed at the central area of the base film; a transfer area formed at the edge area of the base film and including an exposure area exposing the base film; a plurality of sprocket holes arranged in a row on the transfer area; and a metal pattern discretely formed from the wiring pattern, and formed in the transfer area, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, and wherein the exposure area is continuous between the sprocket holes such that the base film is exposed continuously between each sprocket hole and its adjacent sprocket holes.