Package structure and stacked package module with the same

摘要

A package structure includes two insulation layers, three conductive layers, and two electronic components. The first and second conductive layers are disposed on a top surface and a bottom surface of the first insulation layer, respectively. The second insulation layer is disposed over the first conductive layer. The third conductive layer is disposed on a top surface of the second insulation layer. The first and second electronic components are embedded within the first and second insulation layers, respectively. The first conducting terminals of the first electronic component are electrically connected with the first conductive layer and the second conductive layer through at least one first conductive via and at least one second conductive via. The second conducting terminals of the second electronic component are electrically connected with the first conductive layer and/or electrically connected with the third conductive layer through at least one third conductive via.

主权项

1. A package structure, comprising:
a first insulation layer, wherein at least one first conductive via and at least one second conductive via are formed in the first insulation layer; a first conductive layer disposed on a top surface of the first insulation layer and contacted with said at least one first conductive via; a second conductive layer disposed on a bottom surface of the first insulation layer and contacted with said at least one second conductive via; at least one first electronic component embedded within the first insulation layer, and comprising plural first conducting terminals, wherein the plural first conducting terminals are electrically connected with the first conductive layer and the second conductive layer through said at least one first conductive via and said at least one second conductive via; a second insulation layer disposed over the first conductive layer and covering the first conductive layer, wherein at least one third conductive via is formed in the second insulation layer; a third conductive layer disposed on a top surface of the second insulation layer and contacted with said at least one third conductive via; and at least one second electronic component embedded within the second insulation layer and connected to the first conductive layer via an adhesive material, and comprising plural second conducting terminals, wherein the plural second conducting terminals are electrically connected with the first conductive layer and/or electrically connected with the third conductive layer through said at least one third conductive via.