Resin composition for printed circuit board, insulating film, prepreg, and printed circuit board

摘要

Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

主权项

1. A resin composition for a printed circuit board, the resin composition comprising:
a liquid crystal oligomer represented by the following Chemical Formula 4 or 5; an epoxy resin; and a phenolic curing agent having five or more functional groups and represented by the following Chemical Formula 1, n is an integer of 1 to 10, wherein in Chemical Formulas 4 and 5, a is an integer of 13 to 26, b is an integer of 13 to 26, c is an integer of 9 to 21, d is an integer of 10 to 30, and e is an integer of 10 to 30.