Low-inductance power semiconductor assembly

摘要

A low-inductive power semiconductor assembly is provided in which semiconductor switches are arranged behind one another in a main current path.

主权项

1. A power semiconductor assembly, comprising:
a circuit carrier; a plurality of half-bridges each of which comprises a plurality of power switches, the power switches of each half-bridge being integrated in discrete semiconductor chips and connected in series directly or indirectly to a phase output of that half-bridge, the semiconductor chips of each half-bridge being arranged next to one another on the circuit carrier in a first direction, the half-bridges being arranged next to one another on the circuit carrier in a second direction perpendicular to the first direction; and a plurality of flat conductor strips disposed above the half-bridges and electrically insulated from one another by a dielectric, the plurality of conductor strips electrically connecting the at least two half-bridges to each other; wherein a main current direction of each half-bridge extends parallel to the second direction, wherein a main current direction of the flat conductor strips extends parallel to the second direction.