Microelectronic packages having cavities for receiving microelectronic elements

摘要

Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.

主权项

1. A packaged microelectronic element comprising:
a package element having a top face, a bottom face, an edge extending between said top and bottom faces, and a plurality of chip contacts and package contacts exposed at said top face, the package element being an elongated strip, such that a length of the package element is substantially greater than a width of the package element; a microelectronic element having a front face, a rear face, an edge extending between said front and rear faces, and a plurality of bond pads exposed at said front face; and bond wires electrically connecting said bond pads to said chip contacts, said bond wires extending across said edge of said microelectronic element and said package element.