发明名称 Bonding structures and methods of forming the same
摘要 A package includes a package component and a second package component. A first elongated bond pad is at a surface of the first package component, wherein the first elongated bond pad has a first length in a first longitudinal direction, and a first width smaller than the first length. A second elongated bond pad is at a surface of the second package component. The second elongated bond pad is bonded to the first elongated bond pad. The second elongated bond pad has a second length in a second longitudinal direction, and a second width smaller than the second width. The second longitudinal direction is un-parallel to the first longitudinal direction.
申请公布号 US9105485(B2) 申请公布日期 2015.08.11
申请号 US201313789942 申请日期 2013.03.08
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Tran Luan C.;Tu Yeur-Luen;Wang Ching-Chun
分类号 H01L23/48;H01L23/00 主分类号 H01L23/48
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A package comprising: a first package component; a first elongated bond pad at a surface of the first package component, wherein the first elongated bond pad has a first length in a first longitudinal direction, and a first width smaller than the first length; a second package component; and a second elongated bond pad at a surface of the second package component and bonded to the first elongated bond pad, wherein the second elongated bond pad has a second length in a second longitudinal direction, and a second width smaller than the second length, and wherein the second longitudinal direction is un-parallel to the first longitudinal direction, and the first longitudinal direction and the second longitudinal direction are parallel to the surface of the first package component, wherein the first elongated bond pad and the second elongated bond pad are bonded through metal-to-metal bonding, and wherein the first elongated bond pad comprises a first surface comprising a first portion and a second portion, and the second elongated bond pad comprises a second surface comprising a third portion and a fourth portion, with the first portion bonded to the third portion, and the second portion not bonded to the second elongated bond pad, and the fourth portion not bonded to the first elongated bond pad, wherein the first and the second surfaces have a contact area comprising: a first and a second side aligned to a first and a second long edge, respectively, of the first elongated bond pad; and a third and a fourth side aligned to a first and a second long edge, respectively, of the second elongated bond pad, and each of the first and second elongated bond pads has an extended portion on at least one side of the contact area.
地址 Hsin-Chu TW