Prepreg, metal-clad laminate, and printed wiring board

摘要

The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

主权项

1. A prepreg formed from a resin composition and a fabric substrate impregnated with the resin composition,
the resin composition comprising: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler, the resin (B) having the Tg not more than 100° C. having:
a carbonyl group or a siloxane group; andan epoxy group or a phenolic hydroxyl group, the inorganic filler (C) being subjected to surface-treatment with a silane coupling agent represented by a following general formula (1):
YSiX3  (1), in the formula (1), X representing a methoxy group or an ethoxy group, and Y representing an aliphatic alkyl group having 6 to 18 carbon atoms.