发明名称 Curable silicone resin composition, cured product thereof and photosemiconductor apparatus
摘要 The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: (A) (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1),;(B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group,(C) a hydrosilylation catalyst containing a platinum group metal, and(D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B).;Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.
申请公布号 US9105821(B2) 申请公布日期 2015.08.11
申请号 US201314096668 申请日期 2013.12.04
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 Kobayashi Yukito;Iwata Mitsuhiro;Onai Satoshi
分类号 C08K5/5415;H01L33/56;C08G77/24;C08L83/08;C08G77/12;C08G77/20 主分类号 C08K5/5415
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A curable silicone resin composition which is an addition-curable silicone composition and comprises(A) (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1),wherein R1 represents an aliphatic unsaturated group, R2s may be the same or different from each other and each represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms other than an aliphatic unsaturated group, Rf1 represents a CF3—(CF2)m—(CH2)n— groupwhere “m” represents an integer of 0 or more, and “n” represents an integer of 1 or more,“a” represents an integer of 1 to 3, and “x”, “y” and “z” are each an integer of x≧0, y≧1 and z≧0, respectively,(B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group,(C) a hydrosilylation catalyst containing a platinum group metal, and(D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B).
地址 Annaka-Shi, Gunma JP