WAFER PROCESSING APPARATUS HAVING VIBRATION SENSOR

摘要

The purpose of the present invention is to prevent a process accident by detecting a wafer back scratch phenomenon generated when a wafer is processed in advance. A wafer processing apparatus including a vibration detecting sensor according to the present invention relates to a wafer processing apparatus to process the wafer. The wafer processing apparatus comprises: a cup unit where the wafer is held; a base where the cup unit is loaded; a cotter unit including one or more processing spaces having a spraying unit to spray chemicals to the wafer held on the cup unit; and a vibration detecting sensor to detect vibrations caused while processing the wafer held on the cup unit by being included in a predetermined position.