发明名称 LIQUID EJECTING HEAD MANUFACTURING METHOD AND LIQUID EJECTING HEAD
摘要 Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.
申请公布号 US2015217569(A1) 申请公布日期 2015.08.06
申请号 US201514604957 申请日期 2015.01.26
申请人 CANON KABUSHIKI KAISHA 发明人 Otaka Shimpei;Imamura Isao;Shimoyama Hiroyuki;Takahashi Tomohiro
分类号 B41J2/16;H05K3/32 主分类号 B41J2/16
代理机构 代理人
主权项 1. A method of manufacturing a liquid ejecting head for ejecting a liquid, said method comprising the steps of: preparing a member that includes a printing element substrate provided with ejection openings for ejecting liquid, a wiring board provided with an electrical wiring, and an electrical connection, provided between the printing element substrate and the wiring board, for electrically connecting the printing element substrate and the wiring board; supplying a sealant to a region between the printing element substrate and the wiring board that includes the electrical connection; holding a film with a holding member; and covering the electrical connection with the film after said holding step is executed.
地址 Tokyo JP