发明名称 |
CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND SOLDER JOINT |
摘要 |
Providing a core ball wherein a junction melting temperature and a low alpha dose are set for suppressing a soft error generation and solving a mounting problem. A metallic powder as a core is a sphere. A pure degree of a Cu ball of the metallic powder is equal to or higher than 99.9% but equal to or less than 99.995%. A contained amount of one of Pb and Bi or a total contained amount of Pb and Bi is equal to or higher than 1 ppm. A sphericity of the Cu ball is equal to or higher than 0.95. A solder plating film for coating the Cu ball comprises Sn—Bi based alloy. U contained in the solder plating film is equal to or less than 5 ppb and Th is equal to or less than 5 ppb. An alpha dose of the core ball is equal to or less than 0.0200 cph/cm2. |
申请公布号 |
US2015217408(A1) |
申请公布日期 |
2015.08.06 |
申请号 |
US201514613175 |
申请日期 |
2015.02.03 |
申请人 |
Senju Metal lndustry Co., Ltd. |
发明人 |
KAWASAKI Hiroyoshi;KOND Shigeki;IKEDA Atsushi;ROPPONGI Takahiro;SOMA Daisuke;SATO Isamu |
分类号 |
B23K35/02;B23K35/30;H01B1/02;C22C9/00;C22C13/00;C22C13/02;H01L23/00;B23K35/26 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
1: A core ball, comprising:
a sphere-shaped metallic powder forming a core; and a solder plating film coating the surface of said metallic powder; wherein said metallic powder is a sphere in which a metallic degree of purity is equal to or higher than 99.9% but equal to or less than 99.995%, a total contained amount of Pb and/or Bi is equal to or larger than 1 ppm and its sphericity is equal to or higher than 0.95; said solder plating film is a Sn—Bi based Pb-free solder alloy including Bi in an amount of 40-60 mass percent and in which a contained amount of U and Th is equal to or less than 5 ppb respectively; and the alpha dose of said core ball is equal to or less than 0.0200 cph/cm2. |
地址 |
Tokyo JP |