ELECTRONIC PACKAGING WITH VARIABLE THICKNESS MOLD CAP

摘要

PROBLEM TO BE SOLVED: To develop an electronic package and a method of manufacturing the package which may be designed to compensate for warpage.SOLUTION: There is provided an electronic package (200; 500; 600; 700) with improved warpage compensation. The electronic package includes a mold cap (212; 702) having a variable thickness (214; 216; 218; 704; 706). The variable thickness is designed to compensate for warpage of a component (204; 206; 506; 606; 708) underlying the mold cap in either a positive/convex direction (300) or a negative/concave direction (400). The variable thickness can have a mound or dimple design (504; 704). In another embodiment, a method is provided for reducing unit warpage of an electronic package (200; 500; 600; 700) by designing topography (214; 216; 218; 504; 604; 704; 706) of the mold cap (212; 702) to compensate for warpage.