| 发明名称 |
CURABLE EPOXY RESIN COMPOSITIONS |
| 摘要 |
A curable composition including (a) at least one epoxide compound comprising: (i) at least one solid or semi-solid epoxy resin; and (ii) at least one divinylarene dioxide resin compound; and (b) at least one hardener; wherein the curable composition being cured comprises a cured thermoset product having a Tg of greater than about 120° C. A thermoset can be prepared from the above curable composition. |
| 申请公布号 |
US2015218364(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201314422198 |
申请日期 |
2013.09.25 |
| 申请人 |
Dow Global Technologies LLC |
发明人 |
Padilla-Acevedo Angela I.;Theofanous Theofanis;Verghese Nikhil E.;Aguirre Vargas Fabio |
| 分类号 |
C08L63/04;C08L63/00 |
主分类号 |
C08L63/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A curable composition comprising:
(a) at least one epoxide compound comprising:
(i) at least one solid or semi-solid epoxy resin; and(ii) at least one divinylarene dioxide resin compound; and (b) at least one hardener; wherein the curable composition being cured comprises a cured thermoset product having a Tg of greater than about 120° C. |
| 地址 |
Midladn MI US |
