WAFER WORKPIECE, PROVISIONAL ADHESIVE MATERIAL FOR WAFER WORKING, AND THIN WAFER MANUFACTURING METHOD

摘要

The present invention is a wafer workpiece in which a provisional adhesive material layer is formed upon a support body and a wafer, which has a circuit face on the obverse face and is to be worked on the reverse face, is stacked upon the provisional adhesive material layer, wherein the provisional adhesive material layer comprises a complex provisional adhesive material layer having a three-layer structure, further comprising: a first provisional adhesive layer which is formed from a thermoplastic organopolysiloxane polymer layer (A) and is peelably adhered to the obverse face of the wafer; a second provisional adhesive layer which is formed from a heat-curable siloxane denatured polymer layer (B) and is peelably stacked upon the first provisional adhesive layer; and a third provisional adhesive layer which is formed from a heat-curable siloxane polymer layer (C), is peelably adhered to the support body, and is peelably stacked upon the second provisional adhesive layer. Thus are provided a provisional adhesive material for wafer working which can easily be adhered provisionally and peeled and can easily be peeled even if a thin wafer is cut prior to peeling, and a wafer workpiece with which it is possible to produce a thin wafer more efficiently.