| 发明名称 |
STRUCTURED ADHESIVE LAYER |
| 摘要 |
The invention relates to the use of an adhesive tape to adhesively bond printing plates, during which the impairment of the adhesive bonds by air bubble inclusions between the adhesive tape and a substrate should be reduced. This is achieved by using an adhesive tape comprising at least one adhesive layer, wherein the adhesive layer has at least one groove that does not extend to one of the edges of the adhesive layer, and the portion of the entire groove volume of the adhesive layer that is associated with such grooves is more than 50%. |
| 申请公布号 |
US2015218423(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201314424270 |
申请日期 |
2013.08.29 |
| 申请人 |
TESA SE |
发明人 |
Thebud Nils;Ebenau Steffen |
| 分类号 |
C09J7/02;B29C65/50 |
主分类号 |
C09J7/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising bonding a printing plate to a substrate with an adhesive tape, wherein the adhesive tape comprises at least one pressure-sensitively adhesive layer, the adhesive layer having at least one groove that does not extend to one of the edges of the adhesive layer, and
the proportion of the total groove volume of the adhesive layer that is accounted for by such grooves being more than 50%. |
| 地址 |
Hamburg DE |
