发明名称 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE
摘要 Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm2, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.
申请公布号 US2015217409(A1) 申请公布日期 2015.08.06
申请号 US201514613256 申请日期 2015.02.03
申请人 Senju Metal lndustry Co., Ltd. 发明人 AKAGAWA Takashi;KAWASAKI Hiroyoshi;MATSUI Kazuhiko;KOIKEDA Yuichi;SASAKI Masaru;YAMASAKI Hiroyuki;ROPPONGI Takahiro;SOMA Daisuke;SATO Isamu
分类号 B23K35/02;B23K35/30;H01B1/02;C22C19/03;C22C19/07;H01L23/00;C22C5/06 主分类号 B23K35/02
代理机构 代理人
主权项 1: An Ag ball, comprising: an element U, a content thereof being equal to or less than 5 ppb; and an element Th, a content thereof being equal to or less than 5 ppb; wherein a purity of said Ag ball is equal to or more than 99.9% but equal to or less than 99.9995%; an alpha dose of said Ag ball is equal to or less than 0.0200 cph/cm2; a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm; and a sphericity of said Ag ball is equal to or more than 0.90.
地址 Tokyo JP