发明名称 |
Cu-Ga ALLOY SPUTTERING TARGET AND METHOD FOR PRODUCING SAME |
摘要 |
This Cu-Ga alloy sputtering target is a fired body having a composition that contains 29.5-43.0% by atom of Ga with the balance made up of Cu and unavoidable impurities. A Cu-Ga alloy crystal grain in the fired body has a structure wherein γ-phase particles are dispersed in a γ1-phase crystal grain. A method for producing the above-described sputtering target comprises: a step wherein a molded body that is formed of a mixed powder of a pure Cu powder and a Cu-Ga alloy powder is fired at atmospheric pressure by being heated in a reducing atmosphere; and a step wherein the thus-obtained fired body is cooled at a cooling rate of 0.1-1.0°C/min in a temperature range of 450-650°C. |
申请公布号 |
WO2015114914(A1) |
申请公布日期 |
2015.08.06 |
申请号 |
WO2014JP80465 |
申请日期 |
2014.11.18 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
YOSHIDA YUUKI;ISHIYAMA KOUICHI;MORI SATORU |
分类号 |
C23C14/34;B22F1/00;B22F3/10;C22C1/04;C22C1/05;C22C9/00;H01L31/0749 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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