IMAGING DEVICE, ELECTRONIC PREPARATION, AND SOLID-STATE IMAGE ELEMENT

摘要

Provided is a low cost imaging device with high image performance. The imaging device (100) is provided with: a semiconductor chip (1); a package substrate (3) disposed at the backside of the semiconductor chip (1); a wire (7) for electrically connecting the semiconductor chip (1) to the package substrate (3); a transparent substrate (4) to be disposed facing the semiconductor chip (1); and a side wall (9) formed on a surface of the package surface (3) where the semiconductor chip (1) is disposed. The imaging device images an object to be imaged (5) that has been disposed between the semiconductor chip (1) and the transparent substrate (4) in a state in which an encapsulating part (6) is disposed surrounding the object (5).