| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which reduces contact resistance between a semiconductor film and an electrode or wiring, improves the coverage factor between the semiconductor film and the electrode or the wiring, and improves the characteristics.SOLUTION: A semiconductor device includes: a gate electrode located on a substrate; a gate insulation film located on the gate electrode; a first source electrode or a first drain electrode, located on the gate insulation film; an island-shaped semiconductor film located on the first source electrode or the first drain electrode; and a second source electrode or a second drain electrode, located on the island-shaped semiconductor film and the first source electrode or the first drain electrode. The second source electrode or the second drain electrode is in contact with the first source electrode or the first drain electrode. The first source electrode or the first drain electrode and the second source electrode or the second drain electrode hold the island-shaped semiconductor film therebetween. This invention relates to the semiconductor device and a manufacturing method of the semiconductor device. |
