| 发明名称 |
LIGHT EMITTING DIODE PACKAGE AND BACKLIGHT UNIT INCLUDING THE SAME |
| 摘要 |
Provided are a light emitting diode package and a backlight assembly including the light emitting diode package. The light emitting diode package may comprise a package main body including a cavity; a light emitting diode (LED) chip positioned in the cavity; a lead frame installed in the package main body, positioned in the cavity at least partly, electrically connected to the light emitting diode chip mounted on the lead frame, and having one surface having a diffusion reflective layer thereon. |
| 申请公布号 |
US2015221831(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201414282735 |
申请日期 |
2014.05.20 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
KIM Kyung Min;YOON Byung Seo |
| 分类号 |
H01L33/48;H01L33/62;H01L33/60;H01L33/50;H01L33/54 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode package comprising:
a package main body including a cavity; a light emitting diode (LED) chip positioned in the cavity; a lead frame installed in the package main body, positioned in the cavity at least partly, electrically connected to the light emitting diode chip mounted on the lead frame, and having one surface having a diffusion reflective layer thereon. |
| 地址 |
Yongin-City KR |
