| 发明名称 |
Flip-Chip Hybridisation Of Two Microelectronic Components Using A UV Anneal |
| 摘要 |
A method of manufacturing a microelectronic device including a first component hybridized with a second component via electric interconnects, involves the steps of: (i) forming the first and second components, the second component being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; (ii) forming interconnection elements including copper oxide on the second component at the locations provided for the interconnects; (iii) placing the first and second components on each other; and (iv) applying the ultraviolet radiation through the second component on the elements including copper oxide to implement an ultraviolet anneal converting copper oxide into copper. |
| 申请公布号 |
US2015221602(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201314421689 |
申请日期 |
2013.07.31 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
发明人 |
Aliane Abdelkader;Coppard Romain;Tallal Jamal |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a microelectronic device comprising a first component hybridized with a second component by means of electric interconnects said method, comprising the steps of:
forming the first and second components, the second component being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; forming interconnection elements comprising pads made only of copper oxide on the second component at the locations provided for the interconnects; placing the first and second components on each other; and applying ultraviolet radiation through the second component on the elements comprising pads made only of copper oxide to implement an ultraviolet anneal converting copper oxide into copper. |
| 地址 |
Paris FR |
