CHIP WITH PROTECTION FUNCTION AND METHOD FOR PRODUCING SAME

摘要

A chip with varistor function is proposed, comprising a varistor layer (VS) composed of zinc oxide and a multilayered electrode structure therein. Solderable or bondable external contacts (AK) reinforced electrolytically or in an electroless manner are provided on a first main surface of the varistor layer (VS). A glass layer covers the regions of the first main surface that are not provided with metallization. The glass layer has as main constituent oxides of Si and/or Ge, B and K, which in total comprise at least 70% by weight of the constituents of the glass layer, and is substantially free of Al, Ga, Cr and Ti. The glass layer protects the varistor layer during electroplating and permits a thin chip with undamaged varistor function. The chip can be used as substrate for electrical components with integrated protection function.