| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device in which productivity is well balanced with a heat dissipation property.SOLUTION: A light-emitting device 100 is configured by laminating a support 3 at one surface side where a p-side electrode 15 and an n-side electrode 13 of a semiconductor light-emitting element 1 are provided, and laminating a phosphor layer 2 at the other surface side. The support 3 includes: a resin layer 31; a p-side external connection electrode 34p and an n-side external connection electrode 34n which are provided while being exposed on a surface at an opposite side of a surface of the resin layer 31 in contact with the semiconductor light-emitting element 1; and internal wiring provided within the resin layer 31 for connecting the p-side electrode 15p and the p-side external connection electrode 34p and connecting the n-side electrode 13 and the n-side external connection electrode 34n electrically, respectively. The internal wiring connects a metal wire 32p and a metal plating layer 33p and connects a metal wire 32n and a metal plating layer 33n in series, respectively. |
