STRUCTURE MOUNTED WITH ELECTRONIC COMPONENT

摘要

A mounted structure includes an electronic component including external electrodes, a wiring substrate including lands, and joint portions composed of a solder joint material and configured to join the external electrodes and the lands. The external electrodes respectively include coatings that cover a principal surface of a body, which is opposed to the wiring substrate, and coatings that cover end surfaces of the body, which are opposed to each other in the length direction. A distance De between the coatings in the length direction and a distance Dl between the lands in the length direction satisfy a condition of 0.91≦Dl/De≦1.09.

主权项

1. A structure comprising:
a wiring substrate; an electronic component mounted on the wiring substrate via a solder joint material; wherein the electronic component includes:
a body including a first principal surface and a second principal surface opposite to each other in a thickness direction, a first end surface and a second end surface opposite to each other in a length direction perpendicular or substantially perpendicular to the thickness direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular or substantially perpendicular to both the thickness direction and the length direction; anda first external electrode and a second external electrode spaced from each other in the length direction; whereinthe first external electrode includes at least a first coating portion that covers a portion of the second principal surface located closer to the first end surface, and a second coating portion that covers the first end surface;the second external electrode includes at least a third coating portion that covers a portion of the second principal surface located closer to the second end surface, and a fourth coating portion that covers the second end surface; the wiring substrate includes:
a base including a principal surface; anda first land and a second land on the principal surface and spaced from each other; the electronic component includes the first coating portion opposed to the first land and the third coating portion opposed to the second land; the solder joint material includes a first joint portion that joins the first external electrode and the first land, and a second joint portion that joins the second external electrode and the second land; the first joint portion adheres to the first land, and adheres to the first external electrode so as to bridge between the first coating portion and the second coating portion; the second joint portion adheres to the second land, and adheres to the second external electrode so as to bridge between the third coating portion and the fourth coating portion; a maximum outside dimension of the electronic component is denoted by Lc in the length direction and Lc fulfills a condition of Lc≦0.5 mm; and a distance between the first coating portion and the second coating portion in the length direction is denoted by De, a distance between the first land and the second land in the length direction is denoted by Dl, and De and Dl fulfill a condition of 0.91≦Dl/De≦1.09.