发明名称 PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS
摘要 In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.
申请公布号 WO2015116076(A1) 申请公布日期 2015.08.06
申请号 WO2014US13730 申请日期 2014.01.30
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, LP 发明人 LUTNESKY, GARY G;CHOY, SILAM J
分类号 B41J2/045;B41J2/14 主分类号 B41J2/045
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