| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide surface treatment liquid of a metal using an azole silane compound in order to heighten adhesiveness between the metal and a resin material, and to provide a surface treatment method, an adhesion method, an electronic device using them, and a printed wiring board.SOLUTION: An aqueous solution formed by dissolving a silane compound having an azole ring and a disulfide bond (-S-S-) in a molecule illustrated by formula (I-1) is used. In surface treatment liquid, object metals are Cu, Al, Ti, Ni, Sn, Fe, Ag, Au and these metals.</p> |
