| 发明名称 |
HANDHELD DEVICE WITH HEAT PIPE |
| 摘要 |
A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat. |
| 申请公布号 |
US2015220122(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201514614296 |
申请日期 |
2015.02.04 |
| 申请人 |
Samsung Electronics Co., Ltd. ;TTM, Co. Ltd. |
发明人 |
Rhee Bongjae;Jung Chunghyo;Choi Eugene |
| 分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A handheld device comprising:
a circuit board including at least one electronic component; a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and release the absorbed heat in a direction opposite to the at least one electronic component; and a heat sinking material configured to bond the circuit board and the heat pipe to each other. |
| 地址 |
Gyeonggi-do KR |
