| 摘要 |
A hot-melt adhesive agent composition according to the present invention can be used for pseudo-adhesion, and comprises a thermoplastic resin containing an ethylene-propylene copolymer and solid paraffin, wherein the solid paraffin is contained in an amount of 1 to 20 parts by mass relative to 100 parts by mass of the thermoplastic resin and the melt viscosity of the hot-melt adhesive agent composition is 2000 to 10000 mPa·s at 160°C. |
