MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE

摘要

A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

主权项

1. A microelectronic assembly, comprising:
a substrate having first and second opposed surfaces each extending in first and second transverse directions, the substrate having first and second dielectric elements spaced apart from one another in at least one of the first or second transverse directions; a first microelectronic element having a front surface facing toward the first surface and bond pads at the front surface, a rear surface opposite from the front surface, and an edge extending between the front and rear surfaces; a second microelectronic element having a front surface facing toward the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element; and a plurality of terminals exposed at the second surface and electrically connected with the bond pads of the first and second microelectronic elements, the terminals configured for connecting the microelectronic assembly to at least one component external to the assembly.