NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS

摘要

A method of forming a conductive element on a substrate and the resulting assembly are provided. The method includes forming a groove in a sacrificial layer overlying a dielectric region disposed on a substrate. The groove preferably extends along a sloped surface of the substrate. The sacrificial layer is preferably removed by a non-photolithographic method, such as ablating with a laser, mechanical milling, or sandblasting. A conductive element is formed in the groove. The grooves may be formed. The grooves and conductive elements may be formed along any surface of the substrate, including within trenches and vias formed therein, and may connect to conductive pads on the front and/or rear surface of the substrate. The conductive elements are preferably formed by plating and may or may not conform to the surface of the substrate.

主权项

1. A method of forming a conductive element on a substrate, the method comprising:
(a) providing an assembly including a substrate having a front face, a rear face remote from the front face, and a sloped surface extending from the rear face toward the front face, the substrate including a region of dielectric material at at least the sloped surface, the assembly including a sacrificial layer overlying the dielectric region; (b) forming a groove in at least the sacrificial layer, the groove extending along at least the sloped surface, by removing a portion of the sacrificial layer by a non-photolithographic method; and (c) forming a conductive element having cross-sectional dimensions at least partly defined by the groove.