| 摘要 |
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a tape frame lift assembly for a plasma processing chamber includes a capture single ring having an upper surface for supporting a tape frame of a substrate support and for cooling the tape frame. The tape frame lift assembly also includes one or more capture lift arms for moving the capture single ring to and from transfer and processing positions. The tape frame assembly also includes one or more captured lift plate portions, one captured lift plate portion corresponding to one capture lift arm, the one or more captured lift plate portions for coupling the one or more capture lift arms to the capture single ring. |
