发明名称 |
PROCESS FOR TRANSFERRING MICROSTRUCTURES TO A FINAL SUBSTRATE |
摘要 |
A process and a transfer film for transferring microstructures to a flexible or rigid final substrate that offers advantages in both speed and precision is provided. The inventive process involves subjecting a transfer film in a continuous roll-to-roll process to the following operations: either forming microstructures on, or transferring microstructures to a surface of the transfer film; and then transferring the microstructures from the transfer film onto a surface of the final substrate. The microstructures are single or multi-layer structures that are made up of: voids in a substantially planar surface, the voids optionally filled or coated with another material; raised areas in a substantially planar surface; or combinations thereof. |
申请公布号 |
US2015217550(A1) |
申请公布日期 |
2015.08.06 |
申请号 |
US201214421394 |
申请日期 |
2012.08.17 |
申请人 |
Gosnell Jonathan D.;Jordan Gregory R.;Kennedy Caroline B. |
发明人 |
Gosnell Jonathan D.;Jordan Gregory R.;Kennedy Caroline B. |
分类号 |
B32B37/00;B32B37/12;B42D25/355;B32B38/18;B42D15/00;B42D25/47;B32B37/24;B32B38/10 |
主分类号 |
B32B37/00 |
代理机构 |
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代理人 |
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主权项 |
1. A transfer film for transferring microstructures to a final substrate, the transfer film comprising a carrier film and one or more adhesive or binder layers on a surface of the carrier film, wherein the microstructures are single or multi-layer structures that comprise: voids in a substantially planar surface, the voids optionally filled or coated with another material; raised areas in a substantially planar surface; or combinations thereof. |
地址 |
Cumming GA US |