| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device arranged so that the surface discharge is prevented from establishing the electrical continuity between a second surface of a metal plate and a fastening member while suppressing the upsizing of a package. ! SOLUTION: A semiconductor device S1 comprises: a package 100 having a metal plate 10, a semiconductor device 20 mounted on one surface 11 of the metal plate 10, and a mold resin 30 sealing the semiconductor device so that the other surface 12 of the metal plate 10 is exposed; a cooling member 200; a sheet member 300 interposed between the package 100 and the cooling member 200 which are faced to each other; and a screw member 400 by which the cooling member, the package, and the sheet member are fastened together. The sheet member 300 is formed by a porous base material 310 impregnated with an electrically insulative fluid material 320. The mold resin 30 has a protrusion 31. The sheet member 300 is apart from the screw member 400 on a shortest pa |
