| 摘要 |
A driver mounting apparatus (manufacturing apparatus) (40) for an array substrate (mounting substrate) (11b) is provided with: a fixed-type driver supporting part (a fixed-type mounting component supporting part) (42), which supports a driver (mounting component) which is mounted upon a glass substrate (substrate) (GS) from the opposite side of the glass substrate (GS), and which is fixed in position with respect to a direction in which the glass substrate (GS) and a driver (21) overlap; and a movable-type substrate heating unit (43), which is disposed on the side opposite to the fixed-type driver supporting part (42) with respect to the glass substrate (GS), and which can be moved so as to approach the fixed-type driver supporting part (42) in the first-mentioned direction of overlapping and can thereby heat the glass substrate (GS) while pressing same. |
