| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which improves manufacturing efficiency.SOLUTION: In a separable metal foil 10, a first metal foil 10a and a second metal foil 10b smaller than the first metal foil 10a and larger than a region X for production formation are adhered separably in such a manner that an outer peripheral part of the first metal foil 10a protrudes around the second metal foil 10b. The manufacturing method of the wiring board includes: fixing the separable metal foil 10 on a surface of a support substrate 8 including the region X for product formation in a central part and including a frame-shaped marginal region Y surrounding the region X for product formation in an outer peripheral part, while positioning the first metal foil 10a closer to the support substrate 8 in such a manner that the first metal foil 10a covers the region X for product formation and the vicinity thereof; then forming a build-up part 12 by alternately laminating and fixing a plurality of insulation layers 1 and wiring conductor layers 2 on the support substrate 8. On a surface of the separable metal foil 10 at a side where the build-up part 12 is formed, a plating metal layer 2k is attached for covering at least a boundary of the first and second metal foils 10a and 10b. |
