PLASMA ATOMIC LAYER DEPOSITION WITH PULSED PLASMA EXPOSURE

摘要

PROBLEM TO BE SOLVED: To provide techniques of forming a uniform film on an uneven face of a semiconductor substrate having patterns.SOLUTION: While operation of plasma enhanced atomic layer deposition (PEALD) processes using pulsed plasma, pulsed plasma is utilized to achieve a film with high quality sidewalls. The increased sidewall quality corresponds to a film that is overall more uniform in quality.