DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONENT SUBSTRATE AND METHOD EMPLOYING SAME

摘要

A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.

主权项

1. An electrical component substrate, comprising at least one solder pad having a dual solder layer, the dual solder layer comprising a first layer of a self-assembly solder and a second layer of a base solder, the second layer of the base solder being disposed on the solder pad and the first layer of the self-assembly solder being disposed on the second layer, wherein the self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature.