SEMICONDUCTOR DEVICE

摘要

A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members, on each of which is mounted one or a plurality of power semiconductor chips, and a printed circuit board wherein a chip rod-form conductive connection member connected to the power semiconductor chip and a pattern rod-form conductive connection member connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member. The conductive pattern member is formed of a narrow portion and a wide portion, the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member, and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board.

主权项

1. A semiconductor device, comprising:
a first conductive pattern member on which is mounted a first power semiconductor chip and a second conductive pattern member on which is mounted a second power semiconductor chip; and a printed circuit board on which are formed a first wiring pattern and second wiring pattern, wherein the first conductive pattern member is formed of a narrow portion and a wide portion, the first power semiconductor chip is connected to the first wiring pattern via a first rod-form connection member, the second power semiconductor chip is connected to the second wiring pattern via a second rod-form connection member, and the narrow portion of the first conductive pattern member is connected to the second wiring pattern via a third rod-form connection member, and the first conductive pattern member and second power semiconductor chip are electrically connected via the third rod-form connection member, second rod-form connection member, and second wiring pattern.