WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT

摘要

A base substrate includes a ceramic sintered substrate having through holes, first and second metal wirings which are integrally disposed so as to be connected to the surface of the ceramic sintered substrate and the inside of the through holes, and first and second active metal layers which are disposed between the ceramic sintered substrate and the first and second metal wirings.

主权项

1. A wiring board comprising:
a substrate which includes a concave portion having an opening in a surface thereof; a metal wiring which is disposed so as to be connected to the surface of the substrate and the inside of the concave portion; and an active metal layer which is disposed between the metal wiring and the substrate and contains an active metal active for a component contained in the substrate.