POWER-MODULE SUBSTRATE AND POWER MODULE

摘要

To provide a power-module substrate having a multi-layered structure which can meet higher integration by improving a performance of a power-cycle and a performance of a heat cycle: a plurality of circuit-layer metal-plates 4A to 4E, 5A, and 5B made of copper or copper alloy are bonded in a layered state intermediating a first ceramic substrate 2; a metal member 12 connecting both the circuit-layer metal-plates disposed on both surfaces of the first ceramic substrate 2 is inserted into a through hole 11 formed in the first ceramic substrate 2; a second ceramic substrate 3 is bonded on a surface of one side of the circuit-layer metal-plates 4A to 4E, 5A and 5B in the layered state; and a heat-radiation-layer metal-plate 6 made of aluminum or aluminum alloy is bonded on a surface of the second ceramic substrate 3 counter to the circuit-layer metal-plates 4A to 4E, 5A, and 5B.

主权项

1. A power-module substrate wherein:
a plurality of circuit-layer metal-plates made of copper or copper alloy are bonded in a layered state intermediating a first ceramic substrate; a metal member connecting both the circuit-layer metal-plates disposed on both surfaces of the first ceramic substrate is inserted into a through hole formed in the first ceramic substrate; a second ceramic substrate is bonded on a surface of one side of the circuit-layer metal-plates in the layered state; and a heat-radiation-layer metal-plate made of aluminum or aluminum alloy is bonded on a surface of the second ceramic substrate counter to the circuit-layer metal-plates.