发明名称 |
COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COPPER ALLOY THIN FILM FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, CONDUCTIVE PART FOR ELECTRONIC AND ELECTRICAL EQUIPMENT AND TERMINAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for electronic and electrical equipment securely and sufficiently excellent in stress relaxation resistance and excellent in strength and flexural workability, and to provide a copper alloy thin film for electronic and electrical equipment, a conductive part for electronic and electrical equipment and a terminal using the same.SOLUTION: There is provided a copper alloy for electronic and electrical equipment which contains more than 2.0 mass% and 36.5 mass% or less of Zn, 0.10 mass% or more and 0.90 mass% or less of Sn, 0.15 mass% or more and less than 1.00 mass% of Ni, 0.005 mass% or more and 0.100 mass% or less of P and the balance of Cu and inevitable impurities, where the atomic ratio of the content of the elements satisfies 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90 and the strength ratio TS/TSbetween the tensile strength TSin the orthogonal direction to the rolling direction and the tensile strength TSin the parallel direction to the rolling direction is more than 1.09. |
申请公布号 |
JP2015143386(A) |
申请公布日期 |
2015.08.06 |
申请号 |
JP20140227338 |
申请日期 |
2014.11.07 |
申请人 |
MITSUBISHI MATERIALS CORP;MITSUBISHI SHINDOH CO LTD |
发明人 |
MAKI KAZUMASA;MORI HIROYUKI;YAMASHITA DAIKI |
分类号 |
C22C9/04;H01B1/02;H01B5/02 |
主分类号 |
C22C9/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|