| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for mounting an LED element capable of preventing short circuit between an inclined reinforcement piece and an adjacent die pad or lead part.SOLUTION: In a lead frame 10 for mounting an LED element, many package regions 14 are arranged in a multicolumn and a multistage. Each package region 14 includes a die pad where an LED element is mounted, and a lead part adjacent to the die pad. In two package regions 14a and 14b that are adjacent vertically to each other, a lead part 26a in the upper package region 14a and a die pad 25b in the lower package region 14b are coupled with each other by an inclined reinforcement piece 51c. In the die pad 25a or lead part 26b adjacent to the inclined reinforcement piece 51c, corners opposed to the inclined reinforcement piece 51c are cut, respectively (notch parts R and S). |
