| 摘要 |
A covering method including: preparing a mixture containing insulative material and a solvent; applying the mixture over a defective portion; and covering the defective portion with the insulative material by causing the solvent to evaporate from the mixture. In the covering method, the solvent has a boiling point no lower than 178 degrees Celsius, and in the mixture, a weight ratio percentage of the insulative material to the solvent is no lower than 10%. Thus, the defective portion, which may result in a dark spot, can be efficiently covered with insulative material while ensuring that a non-light-emission area that is formed accordingly has the smallest-necessary size and that sufficient insulation is achieved. |
