SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORMED WITH BOND WIRES

摘要

A decoupling capacitor (decap) for circuitry (e.g., an I/O interface) in a semiconductor die is formed using one or more pairs of (parallel) bond wires wire-bonded to bond pads on a top surface of the die. Depending on the implementation, the pairs of bond wires may be horizontally or vertically aligned and may be bonded to I/O and/or array bond pads.

主权项

1. A packaged semiconductor device, comprising:
a semiconductor die having a plurality of bond pads; a first bond wire wire-bonded between a first bond pad and a second bond pad, wherein the first and second bond pads are configured to be charged to a first voltage level; and a second bond wire wire-bonded between a third bond pad and a fourth bond pad, wherein the second bond wire is adjacent to the first bond wire, and the third and fourth bond pads are configured to be charged to a second voltage level different from the first voltage level such that the first and second bond wires function as a decoupling capacitor for the die.