| 发明名称 |
WIRING STRUCTURES AND METHODS OF FORMING THE SAME |
| 摘要 |
In a method of forming a wiring structure, a carbon-containing layer may be formed on a substrate. A conductive layer may be formed on the carbon-containing layer, and the conductive layer may be formed to include a metal. The conductive layer and an upper portion of the carbon-containing layer may be etched to form a wiring and a carbon-containing layer pattern, respectively. |
| 申请公布号 |
US2015221557(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201414452665 |
申请日期 |
2014.08.06 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Cheon-Bae;Han Jung-Hoon;Cho Byung-Hoon |
| 分类号 |
H01L21/8234;H01L23/532;H01L21/311;H01L21/3213;H01L21/768;H01L21/02 |
主分类号 |
H01L21/8234 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a wiring structure, comprising:
forming a carbon-containing layer on a substrate; forming a conductive layer on the carbon-containing layer; and etching the conductive layer and an upper portion of the carbon-containing layer to form a wiring and a carbon-containing layer pattern, respectively. |
| 地址 |
Suwon-si KR |
