发明名称 TEMPERATURE MEASURING METHOD AND PLASMA PROCESSING SYSTEM
摘要 A temperature measuring method for measuring a temperature of a member corresponding to a measuring object arranged within a chamber of a plasma processing apparatus is provided. The temperature measuring method involves obtaining a function (f) for correcting a correction target temperature (Tmeas) according to a measurement window temperature (Tw), the function (f) being computed based on the correction target temperature (Tmeas) corresponding to a temperature of the measuring object measured via a measurement window arranged at the chamber, a reference temperature (Tobj) corresponding to a temperature of the measuring object measured without using the measurement window, and the measurement window temperature (Tw) corresponding to a temperature of the measurement window. The temperature measuring method further involves measuring the correction target temperature (Tmeas), measuring the measurement window temperature (Tw), and correcting the correction target temperature (Tmeas) according to the measurement window temperature (Tw) based on the obtained function (f).
申请公布号 US2015221482(A1) 申请公布日期 2015.08.06
申请号 US201514609554 申请日期 2015.01.30
申请人 Tokyo Electron Limited 发明人 YOSHIDA Yusuke;SON Ryou;SENDA Takahiro;KOHNO Masayuki;MATSUMOTO Naoki
分类号 H01J37/32;G01K15/00 主分类号 H01J37/32
代理机构 代理人
主权项 1. A temperature measuring method for measuring a temperature of a member corresponding to a measuring object arranged within a chamber of a plasma processing apparatus, the temperature measuring method comprising: a function obtaining step of obtaining a function (f) for correcting a correction target temperature (Tmeas) according to a measurement window temperature (Tw), the function (f) being computed based on the correction target temperature (Tmeas) corresponding to a temperature of the measuring object measured via a measurement window arranged at the chamber, a reference temperature (Tobj) corresponding to a temperature of the measuring object measured without using the measurement window, and the measurement window temperature (Tw) corresponding to a temperature of the measurement window; a first measuring step of measuring the correction target temperature (Tmeas); a second measuring step of measuring the measurement window temperature (Tw); and a correction step of correcting the correction target temperature (Tmeas) measured in the first measuring step according to the measurement window temperature (Tw) measured in the second measuring step based on the obtained function (f).
地址 Tokyo JP