| 发明名称 |
Detachable Interface For High Powered Electronic Modules |
| 摘要 |
A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array. |
| 申请公布号 |
US2015223365(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201414429114 |
申请日期 |
2014.07.14 |
| 申请人 |
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. |
发明人 |
Sliech Kevin W.;Dresser Timothy M.;Majcher Jared P. |
| 分类号 |
H05K7/20;H02B1/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A detachable high powered electronic module, comprising:
a high powered electronic module; a power converter module; and mechanical interface configured to detachably couple the high powered electronic module and the power converter module via a heat exchanger assembly and further configured to deliver power received from the power converter module to the high powered electronic module. |
| 地址 |
Nashua NH US |
